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Force sensors for microelectronic packaging applications /

Schwizer, Jürg.

Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. - Berlin ; New York : Springer, 2004.

Includes bibliographical references (p. [165]-174) and index.

ISBN: 3540221875 (hbk.)

LCCN: 2004110615

Nat. Bib. No.: GBA453479 bnb

Nat. Bib. Agency Control No.: 971632855 GyFmDB

Subjects--Topical Terms:
Microelectronic packaging.
Wire bonding (Electronic packaging)

Dewey Class. No.: 621.381SCH-F

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