TY  - BOOK
AU  - Schwizer,Jürg
AU  - Mayer,M.
AU  - Brand,Oliver
TI  - Force sensors for microelectronic packaging applications
SN  - 3540221875 (hbk.)
U1  - 621.381SCH-F 22
PY  - 2004///
CY  - Berlin, New York
PB  - Springer
KW  - Microelectronic packaging
KW  - Wire bonding (Electronic packaging)
N1  - Includes bibliographical references (p. [165]-174) and index
UR  - http://www.loc.gov/catdir/toc/fy054/2004110615.html
UR  - http://www.loc.gov/catdir/enhancements/fy0818/2004110615-d.html
ER  -