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| 008 | 040721s2004 gw a f b 001 0 eng | ||
| 010 | _a 2004110615 | ||
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_a621.381SCH-F _222 |
| 100 | 1 | _aSchwizer, Jürg. | |
| 245 | 1 | 0 |
_aForce sensors for microelectronic packaging applications / _cJ. Schwizer, M. Mayer, O. Brand. |
| 260 |
_aBerlin ; _aNew York : _bSpringer, _c2004. |
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| 504 | _aIncludes bibliographical references (p. [165]-174) and index. | ||
| 650 | 0 | _aMicroelectronic packaging. | |
| 650 | 0 | _aWire bonding (Electronic packaging) | |
| 700 | 1 | _aMayer, M. | |
| 700 | 1 | _aBrand, Oliver, | |
| 856 | 4 | 1 | _uhttp://www.loc.gov/catdir/toc/fy054/2004110615.html |
| 856 | 4 | 2 | _uhttp://www.loc.gov/catdir/enhancements/fy0818/2004110615-d.html |
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